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Elsevier
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Vacuum and Thin-Film Deposition Technologies

Aims and Scope

This book series provides an overview, detailed discussion, and practical consideration of the challenges that must be addressed in order to effectively design and deposit thin films of select materials, including metals, metal oxides, nitrides, oxy-nitrides, carbides, sulfides, selenides, and other non-oxide compounds and alloys.

Thin film production – via physical vapor deposition from processes such as: evaporation, thermal and electron beam, magnetron sputtering, as well as more-chemically enabled methods such as atomic layer deposition, chemical vapor deposition, molecular beam epitaxy, and related methods – is a complex operation, requiring specialized equipment, system design, and operation, as well as a comprehensive understanding of the intrinsic advantages and limitations of each approach. Other chemical or electrochemical deposition methods rely on novel chemistry and less complex but still specialized equipment.

The range of equipment, system designs, and deposition processes enable a wide range of properties in thin films, which can be optimized for specific advanced materials applications, including: sensors, energy conversion and storage, environmental applications, information processing, and quantum computing.

The series is intended to convey detailed introductory and background content as well as a collection of in-depth chapters on various thin-film deposition processes. Specific examples of applications and characterization method selection are also included. Topics to be covered in the series include:

  • Vacuum science and technology

  • Deposition system design and operation

  • Physical vapor deposition

  • Thermal and electron beam evaporation

  • Direct current and radio frequency sputtering

  • Magnetron (including HiPIM) sputtering

  • Atomic layer deposition

  • Molecular beam epitaxy

  • Chemical and electrochemical thin-film deposition processes

  • OMCVD and OMVPE methods and applications

  • Characterization and analysis of thin-film devices

  • Theoretical aspects as related to film deposition and applications

  • Post-deposition processing

  • Materials-specific titles (wide bandgap, ferroelectrics, nitrides, etc)

  • Applications-specific titles (automotive, aerospace, sensors, etc)

Vacuum and Thin Film Deposition Technologies

Editorial Board

The series editor is Aloysius F. Hepp, Chief Technologist at Nanotech Innovations and independent consultant based in Cleveland, Ohio, United States. He earned a PhD in Inorganic Photochemistry in 1983 from MIT and retired in December 2016 from the Photovoltaic & Electrochemical Systems Branch of the NASA Glenn Research Center. He was a visiting fellow at Harvard University from 1992–3. He was awarded the NASA Exceptional Achievement medal in 1997. He has served as an adjunct faculty member at the University of Albany and Cleveland State University. Dr. Hepp has co-authored nearly 200 publications (including six patents) focused on processing of thin films and nanomaterials for I–III–VI solar cells, Li-ion batteries, integrated power devices and flight experiments, and precursors and spray pyrolysis deposition of sulfides and carbon nanotubes.

To discuss a potential contribution to the series, or to submit a proposal, please contact Dr Hepp [email protected] S’ouvre dans une nouvelle fenêtre or Senior Acquisitions Editor Stephen Jones [email protected] S’ouvre dans une nouvelle fenêtre

The editorial board comprises the following members:

María Bernechea, University of Zaragoza, Spain Kanishka Biswas, Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore, India L.S. Cavalcante, Universidade Estadual do Piauí, Teresina, Brazil K.Y. Cheong, Universiti Sains Malaysia, Seberang Perai, Malaysia Lung-Chien Chen, National Taipei University of Technology, Taipei, Taiwan Steve Durbin, University of Hawaiʻi at Mānoa, Honolulu, United States Ken Durose, University of Liverpool, United Kingdom Mariana Amorim Fraga, Universidade Federal de São Paulo, Brazil Qixin Guo, Saga University, Japan Govind Gupta, CSIR–National Physical Laboratory, New Delhi, India Ewa Kowalska, Jagiellonian University, Kraków, Poland Prashant Kumta, University of Pittsburgh, United States Arturo Morales-Acevedo, Centro de Investigación y de Estudios Avanzados del Instituto Politécnico Nacional, Mexico City, Mexico Enrico Napolitani, University of Padua, Italy Hieu Pham Trung Nguyen, Texas Tech University, Lubbock, United States Ryne Raffaelle, Rochester Institute of Technology, United States Neerish Revaprasadu, University of Zululand, Ulundi, South Africa Geneviève Sauvé, Case Western Reserve University, Cleveland, United States André Schleife, University of Illinois Urbana-Champaign, United States Elias Stathatos, University of the Peloponnese, Tripoli, Greece Senthilarasu Sundaram, Teesside University, Middlesbrough, United Kingdom